DocumentCode
2990600
Title
Finite element analysis of hygro-thermal induced failure in plastic packages
Author
Sun, Ning ; Lin, Dachuan ; Yang, Daoguo
Author_Institution
Centre of Micro-electronics Package & Assembly Technol., Guilin Univ. of Electron. Technol., China
fYear
2003
fDate
28-30 Oct. 2003
Firstpage
381
Lastpage
385
Abstract
This paper focuses on ways to analysis the hygro-thermal induced failure mechanism with finite element simulations. The objective is how to evaluate the vapor pressure through the moisture concentration. To predict the position where the failure would happen, a modified Gurson´s model is induced and is expanded to represent the contribution of the vapor pressure.
Keywords
adsorption; environmental degradation; failure analysis; finite element analysis; integrated circuit packaging; moisture; plastic packaging; thermal stress cracking; vapour pressure; voids (solid); Gurson model; PQFP; finite element analysis; hygro-thermal induced crack failure; internal vapor pressure; moisture absorption; moisture concentration; plastic packages; void volume fracture distribution; Absorption; Electronics packaging; Failure analysis; Finite element methods; Integrated circuit modeling; Iron; Moisture; Plastic packaging; Polymers; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location
Shanghai, China
Print_ISBN
0-7803-8168-8
Type
conf
DOI
10.1109/EPTC.2003.1298765
Filename
1298765
Link To Document