• DocumentCode
    29920
  • Title

    Performance and Variability Studies of InGaAs Gate-all-Around Nanowire MOSFETs

  • Author

    Conrad, N. ; SangHong Shin ; Jiangjiang Gu ; Mengwei Si ; Heng Wu ; Masuduzzaman, Muhammad ; Alam, Md. Ashraful ; Ye, Peide D.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
  • Volume
    13
  • Issue
    4
  • fYear
    2013
  • fDate
    Dec. 2013
  • Firstpage
    489
  • Lastpage
    496
  • Abstract
    Furthering Si CMOS scaling requires development of high-mobility channel materials and advanced device structures to improve the electrostatic control. We demonstrate the fabrication of gate-all-around (GAA) indium gallium arsenide (InGaAs) MOSFETs with highly scaled atomic-layer-deposited gate dielectrics. InGaAs, with its high electron mobility, allows higher drive currents and other on-state performance compared to silicon. The GAA structure provides superior electrostatic control of the MOSFET channel with outstanding off-state performance. A subthreshold slope of 72 mV/dec, electron mobility of 764 cm2/V·s, and an on-current of 1.59 mA/μm are demonstrated, for example. Variability studies on on-state and off-state performances caused by the number of nanowire channels are also presented.
  • Keywords
    CMOS integrated circuits; III-V semiconductors; MOSFET; atomic layer deposition; electron mobility; elemental semiconductors; gallium arsenide; indium compounds; nanowires; GAA structure; InGaAs; MOSFET channel; Si; Si CMOS scaling; atomic layer deposition; electron mobility; electrostatic control; gate dielectrics; gate-all-around nanowire; high-mobility channel materials; indium gallium arsenide; nanowire channels; Aluminum oxide; Indium gallium arsenide; Logic gates; MOSFET; Nanoscale devices; Performance evaluation; Gate-all-around; InGaAs; MOSFET; nanowire;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2013.2283854
  • Filename
    6613555