DocumentCode
2992881
Title
Root cause study on lid adhesion failure
Author
Ong, M.C. ; Zhao, X.L. ; Zee, B. ; Joman, P.P. ; Chin, J.M. ; Master, Raj N.
Author_Institution
Device Anal. Lab., Adv. Micro Devices (Singapore) Pte Ltd., Singapore, Singapore
fYear
2008
fDate
4-6 Nov. 2008
Firstpage
1
Lastpage
5
Abstract
This paper studied the factors causing adhesion failure between lid and adhesive. Adhesive curing mechanism has been experimentally investigated in combination of surface behaviour analysis on lid by using FTIR and XPS. The results showed residue on lid surface caused by low water rinse flow can affect the curing condition.
Keywords
X-ray photoelectron spectra; adhesion; curing; electronics packaging; flip-chip devices; FTIR; XPS; adhesive curing; flip-chip package; lid adhesion failure; low water rinse flow; surface behaviour analysis; Adhesives; Bonding forces; Curing; Flanges; Manufacturing; Ovens; Packaging; Sealing materials; Spectroscopy; Tiles;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International
Conference_Location
Penang
ISSN
1089-8190
Print_ISBN
978-1-4244-3392-6
Electronic_ISBN
1089-8190
Type
conf
DOI
10.1109/IEMT.2008.5507812
Filename
5507812
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