DocumentCode
2993635
Title
Slurry Usage Reduction for Failure Analysis Sample Preparation
Author
Saee, Shamsudin Bin ; Seng, Ng Hong ; Mui, Tan Hong
Author_Institution
X-FAB Sarawak, Kuching
fYear
2007
fDate
12-11 Dec. 2007
Firstpage
1
Lastpage
3
Abstract
This paper describes slurry usage reduction for failure analysis (FA). The slurry is applied during final fine polishing for scanning electron microscopy (SEM) sample preparation in failure analysis. The three main factors, slurry concentration, polishing time and down pressure have been evaluated to maintain or improve the SEM images quality while reducing slurry consumables cost. The 0.05 mum blue colloidal silica diluted with de-ionized (DI) water with the ratio of 1:1 has been proven as optimized solution to save up to 46% of total slurry cost annually.
Keywords
failure analysis; polishing; scanning electron microscopy; slurries; specimen preparation; de-ionized water; final fine polishing; slurry concentration; slurry consumables cost; slurry usage reduction; Costs; Delay; Failure analysis; Image quality; Lapping; Polishing machines; Research and development; Scanning electron microscopy; Silicon compounds; Slurries;
fLanguage
English
Publisher
ieee
Conference_Titel
Research and Development, 2007. SCOReD 2007. 5th Student Conference on
Conference_Location
Selangor, Malaysia
Print_ISBN
978-1-4244-1469-7
Electronic_ISBN
978-1-4244-1470-3
Type
conf
DOI
10.1109/SCORED.2007.4451387
Filename
4451387
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