• DocumentCode
    2993635
  • Title

    Slurry Usage Reduction for Failure Analysis Sample Preparation

  • Author

    Saee, Shamsudin Bin ; Seng, Ng Hong ; Mui, Tan Hong

  • Author_Institution
    X-FAB Sarawak, Kuching
  • fYear
    2007
  • fDate
    12-11 Dec. 2007
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    This paper describes slurry usage reduction for failure analysis (FA). The slurry is applied during final fine polishing for scanning electron microscopy (SEM) sample preparation in failure analysis. The three main factors, slurry concentration, polishing time and down pressure have been evaluated to maintain or improve the SEM images quality while reducing slurry consumables cost. The 0.05 mum blue colloidal silica diluted with de-ionized (DI) water with the ratio of 1:1 has been proven as optimized solution to save up to 46% of total slurry cost annually.
  • Keywords
    failure analysis; polishing; scanning electron microscopy; slurries; specimen preparation; de-ionized water; final fine polishing; slurry concentration; slurry consumables cost; slurry usage reduction; Costs; Delay; Failure analysis; Image quality; Lapping; Polishing machines; Research and development; Scanning electron microscopy; Silicon compounds; Slurries;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Research and Development, 2007. SCOReD 2007. 5th Student Conference on
  • Conference_Location
    Selangor, Malaysia
  • Print_ISBN
    978-1-4244-1469-7
  • Electronic_ISBN
    978-1-4244-1470-3
  • Type

    conf

  • DOI
    10.1109/SCORED.2007.4451387
  • Filename
    4451387