High-speed test hardware full path measurement using low loss PCB substrate

Author

Ng Cheong Koon ; Cheah Shu Young ; Chow, Susan See-Chin ; Ong Ling Li

Author_Institution

Intel Corp., Bayan Lepas, Malaysia

fYear

2008

fDate

4-6 Nov. 2008

Firstpage

1

Lastpage

4

Abstract

High-speed Input/Output (I/O) measurements are crucial to ensure good signal integrity performances in High-speed interfaces. Modeling effects enable minimization of the throughput time from design, development and ultimately products to market. However, modeling needs validations to cross check the accuracy. Full path measurement is recommended to validate the performance of components within the channel by cascading them together. This paper introduces the advantages of replacing ceramic surrogate package with a low loss substrate, namely Roger 4350B. Basic concept and measurement setup in Functional/Structural Test and System Test will be explained.

Keywords

printed circuit design; printed circuit testing; Roger 4350B; ceramic surrogate package; high-speed input/output measurement; high-speed test hardware full path measurement; low loss PCB substrate; Ceramics; Electronics packaging; Fixtures; Hardware; Loss measurement; Performance evaluation; Probes; Sockets; System testing; Topology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International

Conference_Location

Penang

ISSN

1089-8190

Print_ISBN

978-1-4244-3392-6

Electronic_ISBN

1089-8190

Type

conf

DOI

10.1109/IEMT.2008.5507877

Filename

5507877