A reliable and compact polymer-based package for capacitive RF-MEMS switches

Author

Oya, Y. ; Okubora, A. ; Van Spengen, M. ; Soussan, P. ; Stoukatch, S. ; Rottenberg, X. ; Ratchev, P. ; Tilmans, H. ; De Raedt, W. ; Beyne, E. ; De Moor, P. ; De Wolf, I. ; Baert, K.

Author_Institution

Sony Corp., Atsugi, Japan

fYear

2004

fDate

13-15 Dec. 2004

Firstpage

31

Lastpage

34

Abstract

We present a package for capacitive RF-MEMS switches that is based on laminate substrates and BCB-sealed glass caps. The assembly is realised using standard packaging equipment. The package is only 1.1 mm thick, gross leak tight, has high mechanical strength, and passes accelerated lifetime testing. RF insertion loss was lower than 0.6 dB below 15 GHz. Capacitive switches packaged by the proposed method reach a lifetime of 10⁷ cycles, and sustain 1000 h exposure at 85°C/85%RH.

Keywords

electronics packaging; microswitches; polymers; reliability; 1.1 mm; BCB-sealed glass caps; RF insertion loss; capacitive RF-MEMS switches; compact polymer-based package; laminate substrates; package reliability; standard packaging equipment; Assembly; Glass; Laminates; Life estimation; Life testing; Packaging machines; Polymers; Radio frequency; Radiofrequency microelectromechanical systems; Switches;

fLanguage

English

Publisher

ieee

Conference_Titel

Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International

Print_ISBN

0-7803-8684-1

Type

conf

DOI

10.1109/IEDM.2004.1419056

Filename

1419056