• DocumentCode
    2998806
  • Title

    Very Large-Scale Integrated Processor

  • Author

    Takano, Shigeyuki

  • Author_Institution
    Sanyo LSI Design Syst. Soft Co., Ltd., Gunma, Japan
  • fYear
    2012
  • fDate
    21-25 May 2012
  • Firstpage
    821
  • Lastpage
    828
  • Abstract
    Many-core processors are designed for improving thread-level parallelism (TLP) across the cores and for keeping instruction-level parallelism (ILP) in each core. However, each application has its own characteristic TLP and ILP. Therefore, a "pre-fabricated" chip multiprocessor (CMP) cannot tolerate a wide range of applications. Recent works attempted to reconfigure the CMP in order to fit the processor to the applications. This paper proposes a scalable processor that is able to up scale and down scale the data path of the adaptive processor. The scaling is based on a chaining interconnection networks between segments. The adaptive processor uses a linear topology to form a stack structure. In order to map the array to a two-dimensional array, a new topology, which we call an S-topology which scales well is also proposed. We assessed costs in terms of area and delay on the S-topology applied to the adaptive processor, and peak performances.
  • Keywords
    VLSI; microprocessor chips; multi-threading; multiprocessing systems; multiprocessor interconnection networks; network topology; parallel architectures; reconfigurable architectures; CMP reconfiguration; ILP; S-topology; TLP; adaptive processor; instruction-level parallelism; interconnection networks; linear topology; many-core processors; pre-fabricated chip multiprocessor; scalable processor; stack structure; thread-level parallelism; two-dimensional array; very large scale integrated processor; Arrays; Multicore processing; Multiprocessor interconnection; Pipelines; Routing; Topology; Very large scale integration; Adaptive Computing; Composable Processor; Fusion Core; Reconfigurable Computing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Parallel and Distributed Processing Symposium Workshops & PhD Forum (IPDPSW), 2012 IEEE 26th International
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4673-0974-5
  • Type

    conf

  • DOI
    10.1109/IPDPSW.2012.101
  • Filename
    6270724