DocumentCode
2999392
Title
Numerically investigating the effects of cross links in scaled microchannel heat sinks
Author
Dang, M. ; Hassan, I. ; Kim, S.I.
Author_Institution
Concordia Univ., Montreal
fYear
2007
fDate
17-19 Sept. 2007
Firstpage
54
Lastpage
59
Abstract
Thermal management for high performance of miniaturized electronic devices using microchannel heat sinks has recently become of interest to researchers and industry. Obtaining heat sink designs with uniform flow distribution is strongly desired. A number of experimental studies have been conducted to seek appropriate designs for microchannel heat sinks. However, pursuing this goal experimentally can be an expensive endeavor. The present work investigates the effect of cross-links on adiabatic two-phase flow in an array of parallel channels. It is carried out using the three-dimensional mixture model from the computational fluid dynamics (CFD) software, Fluent 6.3. A straight channel and two cross-linked channel models were simulated. The cross-links were located at 1/3 and 2/3´s of the channel length, their width varied by one and two times the channel width. All test models had 45 parallel rectangular channels, with a hydraulic diameter of 1.59 mm. The results showed that the trend of flow distribution agrees with experimental results. A new design, with cross-links incorporated, was proposed and the results showed a significant improvement, up to 55%, on flow distribution, compared to the standard straight channel configuration without a penalty in the pressure drop. The effect of cross-links on flow distribution, flow structure, and pressure drop was also documented.
Keywords
computational fluid dynamics; heat sinks; heat transfer; microchannel flow; two-phase flow; Fluent 6.3; adiabatic two-phase flow; computational fluid dynamics; cross links; flow structure; miniaturized electronic devices; parallel channels; pressure drop; scaled microchannel heat sinks; straight channel configuration; thermal management; three-dimensional mixture model; uniform flow distribution; Computational fluid dynamics; Computational modeling; Electronics industry; Heat sinks; Hydraulic diameter; Industrial electronics; Microchannel; Testing; Thermal management; Thermal management of electronics;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
Conference_Location
Budapest
Print_ISBN
978-2-35500-002-7
Type
conf
DOI
10.1109/THERMINIC.2007.4451746
Filename
4451746
Link To Document