Circuit modeling to predict the performance of force-cooled cold plate structures

Author

Pieper, Ronald J. ; Michael, Sherif

Author_Institution

Dept. of Electr. & Comput. Eng., Naval Postgraduate Sch., Monterey, CA, USA

Volume

6

fYear

1999

fDate

36342

Firstpage

105

Abstract

The electronic circuit simulator PSpice can provide the means of obtaining numerical nonanalytic solutions to thermal heat flow problems which would otherwise be difficult or impossible to derive. Rules for relating physical heat flow parameters to equivalent distributed lossy transmission line parameters are derived. This method for numerical evaluation of the heat dissipating performance of complicated fin structures forming cold-stacks is validated by comparison with recently published analytic solutions for double stack cold plates

Keywords

SPICE; cooling; digital simulation; packaging; PSpice; circuit modeling; complicated fin structures; double stack cold plates; electronic circuit simulator; equivalent distributed lossy transmission line parameters; force-cooled cold plate structures; numerical nonanalytic solutions; thermal heat flow problems; Analytical models; Circuits; Cold plates; Differential equations; Electronics packaging; Performance analysis; Performance loss; Power transmission lines; Predictive models; Propagation losses;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems, 1999. ISCAS '99. Proceedings of the 1999 IEEE International Symposium on

Conference_Location

Orlando, FL

Print_ISBN

0-7803-5471-0

Type

conf

DOI

10.1109/ISCAS.1999.780106

Filename

780106