DocumentCode
3007674
Title
Dense Matrix Factorization of Linear Complexity for Impedance Extraction of Large-Scale 3-D Integrated Circuits
Author
Chai, Wenwen ; Jiao, Dan
Author_Institution
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
fYear
2010
fDate
June 28 2010-July 1 2010
Firstpage
1
Lastpage
5
Abstract
A fast LU factorization of linear complexity is developed to directly solve a dense system of linear equations for the interconnect extraction of any arbitrary shaped 3-D structure embedded in inhomogeneous materials. The proposed solver successfully factorizes dense matrices that involve more than one million unknowns in fast CPU run time and modest memory consumption. Comparisons with state-of-the-art integral-equation-based interconnect extraction tools have demonstrated its clear advantages.
Keywords
integral equations; integrated circuit interconnections; matrix decomposition; three-dimensional integrated circuits; LU factorization; dense matrix factorization; impedance extraction; integral equation-based interconnect extraction; large-scale 3D integrated circuits; linear complexity; Central Processing Unit; Computational complexity; Electronics industry; Embedded computing; Impedance; Integral equations; Integrated circuit interconnections; Large scale integration; Sparse matrices; Three-dimensional integrated circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro/Nano Symposium (UGIM), 2010 18th Biennial University/Government/Industry
Conference_Location
West Lafayette, IN
ISSN
0749-6877
Print_ISBN
978-1-4244-4731-2
Electronic_ISBN
0749-6877
Type
conf
DOI
10.1109/UGIM.2010.5508930
Filename
5508930
Link To Document