• DocumentCode
    3007674
  • Title

    Dense Matrix Factorization of Linear Complexity for Impedance Extraction of Large-Scale 3-D Integrated Circuits

  • Author

    Chai, Wenwen ; Jiao, Dan

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
  • fYear
    2010
  • fDate
    June 28 2010-July 1 2010
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    A fast LU factorization of linear complexity is developed to directly solve a dense system of linear equations for the interconnect extraction of any arbitrary shaped 3-D structure embedded in inhomogeneous materials. The proposed solver successfully factorizes dense matrices that involve more than one million unknowns in fast CPU run time and modest memory consumption. Comparisons with state-of-the-art integral-equation-based interconnect extraction tools have demonstrated its clear advantages.
  • Keywords
    integral equations; integrated circuit interconnections; matrix decomposition; three-dimensional integrated circuits; LU factorization; dense matrix factorization; impedance extraction; integral equation-based interconnect extraction; large-scale 3D integrated circuits; linear complexity; Central Processing Unit; Computational complexity; Electronics industry; Embedded computing; Impedance; Integral equations; Integrated circuit interconnections; Large scale integration; Sparse matrices; Three-dimensional integrated circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro/Nano Symposium (UGIM), 2010 18th Biennial University/Government/Industry
  • Conference_Location
    West Lafayette, IN
  • ISSN
    0749-6877
  • Print_ISBN
    978-1-4244-4731-2
  • Electronic_ISBN
    0749-6877
  • Type

    conf

  • DOI
    10.1109/UGIM.2010.5508930
  • Filename
    5508930