Paperless manufacturing for IC assembly

Author

Ram, Satish N. ; Wang, Shay-Ping T.

Author_Institution

Motorola Inc., Chandler, AZ, USA

fYear

1992

fDate

15-16 Jun 1992

Firstpage

90

Lastpage

93

Abstract

The ongoing paperless manufacturing programs in application-specific integrated circuit (ASIC) assembly operations are described. Drawbacks of paperwork and approaches to paperwork elimination are discussed. Two projects related to paperless manufacturing in ASIC assembly are presented: an automated marking system project, which minimized operator input during product marking operation, and an electronic specification system project, which facilitated point-of-use specification retrieval. Some aspects of an integrated shop floor control system that addresses process control and lot tracking issues are discussed

Keywords

CAD/CAM; application specific integrated circuits; assembling; integrated circuit manufacture; process control; tracking systems; IC assembly; application-specific integrated circuit; automated marking system; electronic specification system; integrated shop floor control system; lot tracking; paperless manufacturing programs; process control; Application specific integrated circuits; Assembly; Automatic control; Computer networks; Contamination; Control systems; Microcomputers; Process control; Pulp manufacturing; Semiconductor device packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Science Symposium, 1992. ISMSS 1992., IEEE/SEMI International

Conference_Location

San Francisco, CA

Print_ISBN

0-7803-0680-5

Type

conf

DOI

10.1109/ISMSS.1992.197643

Filename

197643