An approach to measurement and evaluation of the thermal conductivity of the thermal adhesives in electronic packaging

Author

Falat, Tomasz ; Platek, Bartosz ; Tesarski, Sebastian ; Felba, Jan

Author_Institution

Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wroclaw, Poland

fYear

2009

fDate

13-17 May 2009

Firstpage

1

Lastpage

4

Abstract

In the following paper the measurement method of thermal conductivity is described. This method was especially designed for measuring the thermal conductivity of the thermal adhesives. The principal informations about heat transfer are given, and the experimental setup, mathematical model of experiment and its uncertainty with 95% of probability are shown. The thermal conductivity of polymer based material filled in 0.5% with carbon nanotubes is measured.

Keywords

carbon nanotubes; conductive adhesives; electronics packaging; heat transfer; measurement uncertainty; polymers; thermal conductivity measurement; carbon nanotubes; electronic packaging; heat transfer; microelectronics; thermal conductivity measurement; thermally conductive adhesives; uncertainty measurement; Conducting materials; Conductivity measurement; Design methodology; Electronic packaging thermal management; Electronics packaging; Heat transfer; Mathematical model; Organic materials; Polymers; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology, 2009. ISSE 2009. 32nd International Spring Seminar on

Conference_Location

Brno

Print_ISBN

978-1-4244-4260-7

Type

conf

DOI

10.1109/ISSE.2009.5207017

Filename

5207017