DocumentCode
3011590
Title
An Improved Parallel Implementation of 3-D DRIE Simulation on Multi-core Processors
Author
Fan Zhang ; Gang Wang ; Xiaoguang Liu ; Guangyi Sun ; Xin Zhao ; Jing Liu ; Guizhang Lu
Author_Institution
Coll. of Inf. Tech. Sci., Nankai Univ., Tianjin
fYear
2008
fDate
25-27 Sept. 2008
Firstpage
891
Lastpage
896
Abstract
Deep reactive ion etching (DRIE) technique is a new and powerful tool in micro-electro-mechanical systems (MEMS) fabrication. A 3-D DRIE simulation can help researcher understand the time-evolution of Bosch process used in DRIE. Due to the high complexity of the algorithm used in the simulation, it is necessary to develop an algorithm that can speedup the simulation. This paper presents a parallel implementation of the 3-D DRIE simulation based on multi-core processor. The algorithm is based on data partition. We examine four different data partition strategies and find two-dimensional block-cyclic distribution can obtain perfect load balance. The experimental results show that the parallel algorithm obtains a substantial speedup over the serial algorithm on an Intel quad-core computer.
Keywords
digital simulation; micromechanical devices; parallel algorithms; production engineering computing; resource allocation; sputter etching; 3-D DRIE simulation; Bosch process; Intel quad-core computer; MEMS fabrication; data partition; deep reactive ion etching technique; load balance; microelectromechanical systems fabrication; multicore processors; parallel algorithm; two-dimensional block-cyclic distribution; Computational modeling; Etching; Fabrication; Microelectromechanical systems; Micromechanical devices; Multicore processing; Parallel algorithms; Partitioning algorithms; Polymers; Sun; Keywords 3-D DRIE Simulation; data partition; load balancing; multi-core; parallel algorithm;
fLanguage
English
Publisher
ieee
Conference_Titel
High Performance Computing and Communications, 2008. HPCC '08. 10th IEEE International Conference on
Conference_Location
Dalian
Print_ISBN
978-0-7695-3352-0
Type
conf
DOI
10.1109/HPCC.2008.23
Filename
4637799
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