• DocumentCode
    3011590
  • Title

    An Improved Parallel Implementation of 3-D DRIE Simulation on Multi-core Processors

  • Author

    Fan Zhang ; Gang Wang ; Xiaoguang Liu ; Guangyi Sun ; Xin Zhao ; Jing Liu ; Guizhang Lu

  • Author_Institution
    Coll. of Inf. Tech. Sci., Nankai Univ., Tianjin
  • fYear
    2008
  • fDate
    25-27 Sept. 2008
  • Firstpage
    891
  • Lastpage
    896
  • Abstract
    Deep reactive ion etching (DRIE) technique is a new and powerful tool in micro-electro-mechanical systems (MEMS) fabrication. A 3-D DRIE simulation can help researcher understand the time-evolution of Bosch process used in DRIE. Due to the high complexity of the algorithm used in the simulation, it is necessary to develop an algorithm that can speedup the simulation. This paper presents a parallel implementation of the 3-D DRIE simulation based on multi-core processor. The algorithm is based on data partition. We examine four different data partition strategies and find two-dimensional block-cyclic distribution can obtain perfect load balance. The experimental results show that the parallel algorithm obtains a substantial speedup over the serial algorithm on an Intel quad-core computer.
  • Keywords
    digital simulation; micromechanical devices; parallel algorithms; production engineering computing; resource allocation; sputter etching; 3-D DRIE simulation; Bosch process; Intel quad-core computer; MEMS fabrication; data partition; deep reactive ion etching technique; load balance; microelectromechanical systems fabrication; multicore processors; parallel algorithm; two-dimensional block-cyclic distribution; Computational modeling; Etching; Fabrication; Microelectromechanical systems; Micromechanical devices; Multicore processing; Parallel algorithms; Partitioning algorithms; Polymers; Sun; Keywords 3-D DRIE Simulation; data partition; load balancing; multi-core; parallel algorithm;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Performance Computing and Communications, 2008. HPCC '08. 10th IEEE International Conference on
  • Conference_Location
    Dalian
  • Print_ISBN
    978-0-7695-3352-0
  • Type

    conf

  • DOI
    10.1109/HPCC.2008.23
  • Filename
    4637799