DocumentCode
3023932
Title
Comparison of mechanical deflection and maximum stress of 3C SiC- and si-based pressure sensor diaphragms for extreme environment
Author
Marsi, Noraini ; Majlis, Burhanuddin Yeop ; Hamzah, Azrul Azlan ; Mohd-Yasin, Faisal
Author_Institution
Inst. of Microeng. & Nanoelectron. (IMEN), Univ. Kebangsaan Malaysia (UKM), Bangi, Malaysia
fYear
2012
fDate
19-21 Sept. 2012
Firstpage
186
Lastpage
190
Abstract
The design of a capacitive-sensing pressure sensor for extreme environment is proposed in this project. The movable diaphragm (top plate) is made of either cubic silicon carbide (3C-SiC) or Silicon (Si), while the fix diaphragm (bottom plate) is made of Si. This paper specifically compares the mechanical performance of the movable diaphragm utilizing both materials. Two important parameters associated with the behavior of the diaphragm are examined, namely the maximum deflection and maximum stress, and they are simulated at a pressure of 0-100 MPa, and at temperature of 27-1000 °C. The graphs of maximum deflection and stress vs pressures at different temperatures and thicknesses are plotted to summarize the data. SiC diaphragm has lower deflection and stress compares to Si diaphragm at different thicknesses, pressures and temperatures. Then, a linear regression analysis is performed to determine the R-square value. It is shown from these analyses that SiC diaphragm exhibits better linear behavior compares to Si diaphragm. Generally, this work proves that SiC is a better material over Si for the development of a pressure sensor at extreme environment.
Keywords
capacitive sensors; diaphragms; pressure sensors; regression analysis; silicon compounds; 3C SiC-based pressure sensor diaphragms; R-square value; Si-based pressure sensor diaphragms; SiC; capacitive-sensing pressure sensor; cubic silicon carbide; linear regression analysis; maximum stress; mechanical deflection; movable diaphragm; pressure 0 MPa to 100 MPa; temperature 27 C to 1000 C; Equations; Mathematical model; Silicon; Silicon carbide; Stress; Temperature sensors; diaphragm; harsh environment; pressure sensor; silicon carbide (SiC);
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics (ICSE), 2012 10th IEEE International Conference on
Conference_Location
Kuala Lumpur
Print_ISBN
978-1-4673-2395-6
Electronic_ISBN
978-1-4673-2394-9
Type
conf
DOI
10.1109/SMElec.2012.6417120
Filename
6417120
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