DocumentCode
3024653
Title
Effect of copper FAB impact on palladium bond pad
Author
Sauli, Zaliman ; Retnasamy, Vithyacharan ; Taniselass, Steven ; Norhaimi, W.M.W. ; Aziz, M.H.A. ; Hashim, M.N.
Author_Institution
Sch. of Microelectron. Eng., Univ. Malaysia Perlis (UniMAP), Alam Pauh Putra, Malaysia
fYear
2012
fDate
19-21 Sept. 2012
Firstpage
316
Lastpage
319
Abstract
In this study, the initial impact stage of the copper free air ball (FAB) towards the palladium bond pad had been analyzed by using simulation. The effect of copper FAB impact on palladium bond pad was evaluated by simulation using the commercial computational software Ansys. The impact forces of copper FAB were varied from 1N to 5N. The stress response on copper FAB, lead frame and bond pad were obtained at various bond force were. The simulation results showed that when the applied force increases, the stress level on all these three parts increased. Highest stress response was recorded at impact force of 5N.
Keywords
copper; lead bonding; palladium; Ansys computational software; copper free air ball; impact force; palladium bond pad; stress response; Bonding; Copper; Force; Palladium; Stress; Wires; Copper wire; copper FAB; palladium bond pad;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics (ICSE), 2012 10th IEEE International Conference on
Conference_Location
Kuala Lumpur
Print_ISBN
978-1-4673-2395-6
Electronic_ISBN
978-1-4673-2394-9
Type
conf
DOI
10.1109/SMElec.2012.6417149
Filename
6417149
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