Nanomechanical optical devices fabricated with aligned wafer bonding

Author

Gui, C. ; Veldhuis, G.J. ; Koster, T.M. ; Lambeck, P.V. ; Berenschot, J.W. ; Gardeniers, J.G.E. ; Elwenspoek, M.

Author_Institution

MESA Res. Inst., Twente Univ., Enschede, Netherlands

fYear

1998

fDate

25-29 Jan 1998

Firstpage

482

Lastpage

487

Abstract

This paper reports on a new method for making some types of integrated optical nanomechanical devices. Intensity modulators as well as phase modulators were fabricated using several silicon micromachining techniques, including chemical mechanical polishing and aligned wafer bonding. This new method enables batch fabrication of the nanomechanical optical devices, and enhances their performance

Keywords

elemental semiconductors; integrated optics; membranes; micromachining; micromechanical devices; optical modulation; polishing; silicon; wafer bonding; Si; Si micromachining; aligned wafer bonding; chemical mechanical polishing; integrated optical nanomechanical devices; intensity modulators; nanomechanical optical devices; phase modulators; stiction; Chemicals; Integrated optics; Intensity modulation; Micromachining; Nanoscale devices; Optical devices; Optical modulation; Phase modulation; Silicon; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 1998. MEMS 98. Proceedings., The Eleventh Annual International Workshop on

Conference_Location

Heidelberg

ISSN

1084-6999

Print_ISBN

0-7803-4412-X

Type

conf

DOI

10.1109/MEMSYS.1998.659805

Filename

659805