Study on SAW devices having face to face aligned packaged structure

Author

Koh, Keishin ; Yamazaki, Takanori ; Terao, Yuji ; Hohkawa, Kohji

Author_Institution

Fac. of Eng., Kanagawa Inst. of Technol., Kanagawa

fYear

2008

fDate

2-5 Nov. 2008

Firstpage

1596

Lastpage

1599

Abstract

In this paper, we will report novel method to realize small packaged size SAW device and functional SAW devices, in which two SAW devices are bonded by face to face bonding (FFB). We propose several kinds of FFB SAW devices and package structure of FFB SAW devices. We propose fabrication process such as via holes formation, bonding and dicing, we fabricated test devices using Quartz substrate and estimate basic characteristics of device and experiment results verify the possibility of this packaging method. We investigated effect of various parameters such as adhesive material thickness, dimension of package.

Keywords

surface acoustic wave devices; wafer bonding; wafer level packaging; Quartz substrate; adhesive material thickness; dicing; fabrication process; face-to-face aligned packaged structure; face-to-face bonding; functional SAW devices; hole formation; package dimension; packaging method; Aging; Costs; Electronics packaging; Fabrication; Packaging machines; Surface acoustic wave devices; Surface acoustic waves; Temperature; Wafer bonding; Wafer scale integration; Face to Face bonding; Packaging; SAW devices; Wafer level chip size packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics Symposium, 2008. IUS 2008. IEEE

Conference_Location

Beijing

Print_ISBN

978-1-4244-2428-3

Electronic_ISBN

978-1-4244-2480-1

Type

conf

DOI

10.1109/ULTSYM.2008.0389

Filename

4803594