• DocumentCode
    3027204
  • Title

    Resistive Switching of Al/Sol-Gel ZnO/Al Devices for Resistive Random Access Memory Applications

  • Author

    Deshpande, Saniya ; Nair, Vineet Vijayakrishnan

  • Author_Institution
    Electron. & Electr. Eng., BITS, Pilani, India
  • fYear
    2009
  • fDate
    28-29 Dec. 2009
  • Firstpage
    471
  • Lastpage
    473
  • Abstract
    Unipolar resistive switching devices are investigated for non volatile memory applications in a metal-insulator-metal structure in which the insulator layer consists of sol-gel-derived zinc oxide (ZnO) films prepared by a simple spin-coating process followed by thermal annealing. A high off-to-on resistance ratio (>102) is demonstrated. The influence of device area on the device is studied to suggest a mechanism for the resistive switching. The effect of annealing temperature on crystallinity and thus switching behavior is studied. In addition, the memory characteristics are studied as a function of ZnO film thickness. The devices exhibit reproducible resistive switching and good retention time, demonstrating their potential for low-cost non volatile memory applications in the future.
  • Keywords
    MIM devices; aluminium; annealing; random-access storage; sol-gel processing; switching circuits; zinc compounds; Al-ZnO-Al; annealing temperature effect; crystallinity; film thickness; high off-to-on resistance ratio; metal-insulator-metal structure; nonvolatile memory applications; resistive random access memory applications; sol-gel-derived films; unipolar resistive switching devices; Annealing; Crystallization; Electrodes; Random access memory; Telecommunication switching; Temperature; Thermal resistance; Thin film transistors; Voltage; Zinc oxide; Resistance Random Access Memory (RRAM); non-volatile memory; resistive switching; sol-gel; zinc oxide (ZnO) I;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advances in Computing, Control, & Telecommunication Technologies, 2009. ACT '09. International Conference on
  • Conference_Location
    Trivandrum, Kerala
  • Print_ISBN
    978-1-4244-5321-4
  • Electronic_ISBN
    978-0-7695-3915-7
  • Type

    conf

  • DOI
    10.1109/ACT.2009.122
  • Filename
    5376559