DocumentCode
3030112
Title
Multi-project chip activities in Korea-IDEC perspective
Author
Kyung, Chong-Min ; Park, In-Cheol ; Song, Ho-Jun
Author_Institution
Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Seoul, South Korea
fYear
1997
fDate
28-31 Jan 1997
Firstpage
353
Lastpage
357
Abstract
This paper describes the current status of multi-project chip (MPC) services in Korea to promote full-custom and semi-custom IC design activities in universities. Although MPC foundry services for IC designs were started in a lesser scale more than 10 years ago, it is only recently that systematic and effective education has developed. The MPC foundry services program called IDEC (IC design education center) was launched with the planned support of the government and three major semiconductor companies in Korea. The paper introduces the activities of IDEC and other MPC foundry services
Keywords
VLSI; application specific integrated circuits; circuit CAD; electronic engineering education; integrated circuit design; CAD; IC design education center; IDEC; Korea; MPC foundry services program; VLSI; custom IC design; electronic engineering education; government; integrated circuit design; multiproject chip activities; semiconductor companies; universities; Chip scale packaging; Design automation; Educational institutions; Educational programs; Electronics industry; Foundries; Government; Libraries; System analysis and design; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 1997. Proceedings of the ASP-DAC '97 Asia and South Pacific
Conference_Location
Chiba
Print_ISBN
0-7803-3662-3
Type
conf
DOI
10.1109/ASPDAC.1997.600207
Filename
600207
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