Diagnostic analysis of silicon photovoltaic modules after 20-year field exposure

Author

Quintana, M.A. ; King, D.L. ; Hosking, F.M. ; Kratochvil, J.A. ; Johnson, R.W. ; Hansen, B.R. ; Dhere, N.G. ; Pandit, M.B.

Author_Institution

Sandia Nat. Labs., Albuquerque, NM, USA

fYear

2000

fDate

2000

Firstpage

1420

Lastpage

1423

Abstract

The objective of this study was to investigate the technology used by Spectrolab Inc. to manufacture photovoltaic modules that have provided twenty years of reliable service at Natural Bridges National Monument in southeastern Utah. A field survey, system performance tests, and a series of module and materials tests have confirmed the durability of the modules in the array. The combination of manufacturing processes, materials, and quality controls used by Spectrolab resulted in modules that have maintained a performance level close to the original specifications for twenty years. Specific contributors to the durability of the modules included polyvinyl-butyral (PVB) encapsulant, expanded metal interconnects, silicon oxide anti-reflective coating, and excellent solder/substrate solderability

Keywords

elemental semiconductors; fault diagnosis; semiconductor device manufacture; semiconductor device measurement; semiconductor device reliability; semiconductor device testing; silicon; solar cell arrays; 20 y; PV modules manufacture; Si; Spectrolab Inc.; diagnostic analysis; durability; expanded metal interconnects; field survey; performance tests; photovoltaic modules; polyvinyl-butyral encapsulant; quality controls; silicon oxide anti-reflective coating; solder/substrate solderability; Bridges; Coatings; Manufacturing processes; Materials testing; Photovoltaic systems; Quality control; Silicon; Solar power generation; System performance; System testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Photovoltaic Specialists Conference, 2000. Conference Record of the Twenty-Eighth IEEE

Conference_Location

Anchorage, AK

ISSN

0160-8371

Print_ISBN

0-7803-5772-8

Type

conf

DOI

10.1109/PVSC.2000.916159

Filename

916159