DocumentCode
3033826
Title
A channel engineering combined with channel epitaxy optimization and TED suppression for 0.15 /spl mu/m n-n gate CMOS technology
Author
Abiko, H. ; Ono, A. ; Ueno, R. ; Masuoka, S. ; Shishiguchi, S. ; Nakajima, K. ; Sakai, I.
Author_Institution
ULSI Device Dev. Lab., NEC Corp., Sagamihara, Japan
fYear
1995
fDate
6-8 June 1995
Firstpage
23
Lastpage
24
Abstract
A new channel engineering combined with optimization of channel epitaxy and suppression of TED (transient enhanced diffusion) is proposed for a practical 0.15 /spl mu/m n-n gate CMOS technology. An optimized channel profile with small Vth fluctuation provides an nMOS with no reverse short channel effect and a high performance BCpMOS.
Keywords
CMOS integrated circuits; doping profiles; integrated circuit technology; ion implantation; large scale integration; vapour phase epitaxial growth; 0.15 micron; TED suppression; channel engineering; channel epitaxy optimization; n-n gate CMOS technology; optimized channel profile; transient enhanced diffusion suppression; Atomic layer deposition; Boron; CMOS process; CMOS technology; Epitaxial growth; Epitaxial layers; Fluctuations; MOS devices; National electric code; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, 1995. Digest of Technical Papers. 1995 Symposium on
Conference_Location
Kyoto, Japan
Print_ISBN
0-7803-2602-4
Type
conf
DOI
10.1109/VLSIT.1995.520841
Filename
520841
Link To Document