High thermally conductive underfill for flip-chip applications

Author

Suzuki, Kenichi ; Suzuki, Osamu ; Muramatu, Kazuo ; Yuda, Toshihide ; Isobe, Kohei ; Maruyama, Hideki ; Fukuyama, Hiroyuki

Author_Institution

R&D Dept., NAMICS Corp., Niigata, Japan

fYear

2001

fDate

2001

Firstpage

46

Lastpage

50

Abstract

High thermal conductivity underfill has been developed. The underfill is filled with fine particle size aluminum nitride that provides the high thermal conductivity and good fluidity. Also, this product satisfies the basic requirements for underfill, such as the Level 3 JEDEC preconditioning test. This paper presents work in developing an approach to underfill material for flip-chip packaging using aluminum nitride

Keywords

aluminium compounds; encapsulation; filled polymers; flip-chip devices; integrated circuit packaging; integrated circuit testing; particle reinforced composites; particle size; thermal conductivity; AlN; Level 3 JEDEC preconditioning test; aluminum nitride; fine particle size aluminum nitride; flip-chip applications; flip-chip packaging; fluidity; thermal conductivity; thermally conductive underfill; underfill; underfill material; Aluminum nitride; Conducting materials; Electrical resistance measurement; Materials science and technology; Packaging; Silicon compounds; Thermal conductivity; Thermal factors; Thermal management; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-930815-64-5

Type

conf

DOI

10.1109/ISAOM.2001.916547

Filename

916547