DocumentCode
304138
Title
Commercial application of the compliant pad: a space technology innovation
Author
Ring, Peter J. ; Elsner, Norbert
Author_Institution
Adv. Methods & Mater., San Jose, CA, USA
Volume
1
fYear
1996
fDate
11-16 Aug 1996
Firstpage
119
Abstract
This paper describes the work done to transfer technology developed in the course of the SP-100 Space Reactor Program to commercial applications. During the SP-100 Space Reactor program, under the direction of the Jet Propulsion Laboratory, an array of technology was developed and several technological needs identified. One such need was for a device to connect materials with high thermal expansion coefficients to materials with low thermal expansion coefficients across a significant temperature gradient. To accomplish this, the `compliant pad´ was developed. The pad was designed to offset or compensate for the differential thermal expansion between the components of a complex thermoelectric cell used to convert the heat from the SP-100 nuclear reactor to electricity. Differential thermal expansion can cause major stresses resulting in boning, bending or cracking of components. The work outlined describes the effort to produce a lower temperature, more affordable compliant pad, and the planned testing of the pads with thermoelectric modules to demonstrate the technology conversion under realistic commercial conditions and determine their heat transfer effectiveness, efficiency, ease of use and reliability
Keywords
compensation; heat transfer; temperature distribution; thermal analysis; thermal expansion; thermoelectric conversion; SP-100 Space Reactor Program; compliant pad; differential thermal expansion compensation; ease of use; efficiency; heat transfer effectiveness; reliability; space technology innovation; temperature gradient; terrestrial power generation; thermal expansion coefficients; thermoelectric generators; thermoelectric modules; Energy conversion; Inductors; Laboratories; Propulsion; Resistance heating; Space technology; Temperature; Thermal expansion; Thermal stresses; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Energy Conversion Engineering Conference, 1996. IECEC 96., Proceedings of the 31st Intersociety
Conference_Location
Washington, DC
ISSN
1089-3547
Print_ISBN
0-7803-3547-3
Type
conf
DOI
10.1109/IECEC.1996.552856
Filename
552856
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