• DocumentCode
    304138
  • Title

    Commercial application of the compliant pad: a space technology innovation

  • Author

    Ring, Peter J. ; Elsner, Norbert

  • Author_Institution
    Adv. Methods & Mater., San Jose, CA, USA
  • Volume
    1
  • fYear
    1996
  • fDate
    11-16 Aug 1996
  • Firstpage
    119
  • Abstract
    This paper describes the work done to transfer technology developed in the course of the SP-100 Space Reactor Program to commercial applications. During the SP-100 Space Reactor program, under the direction of the Jet Propulsion Laboratory, an array of technology was developed and several technological needs identified. One such need was for a device to connect materials with high thermal expansion coefficients to materials with low thermal expansion coefficients across a significant temperature gradient. To accomplish this, the `compliant pad´ was developed. The pad was designed to offset or compensate for the differential thermal expansion between the components of a complex thermoelectric cell used to convert the heat from the SP-100 nuclear reactor to electricity. Differential thermal expansion can cause major stresses resulting in boning, bending or cracking of components. The work outlined describes the effort to produce a lower temperature, more affordable compliant pad, and the planned testing of the pads with thermoelectric modules to demonstrate the technology conversion under realistic commercial conditions and determine their heat transfer effectiveness, efficiency, ease of use and reliability
  • Keywords
    compensation; heat transfer; temperature distribution; thermal analysis; thermal expansion; thermoelectric conversion; SP-100 Space Reactor Program; compliant pad; differential thermal expansion compensation; ease of use; efficiency; heat transfer effectiveness; reliability; space technology innovation; temperature gradient; terrestrial power generation; thermal expansion coefficients; thermoelectric generators; thermoelectric modules; Energy conversion; Inductors; Laboratories; Propulsion; Resistance heating; Space technology; Temperature; Thermal expansion; Thermal stresses; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Engineering Conference, 1996. IECEC 96., Proceedings of the 31st Intersociety
  • Conference_Location
    Washington, DC
  • ISSN
    1089-3547
  • Print_ISBN
    0-7803-3547-3
  • Type

    conf

  • DOI
    10.1109/IECEC.1996.552856
  • Filename
    552856