• DocumentCode
    3042731
  • Title

    Microelectromechanical Metal-Air-Insulator-Semiconductor (MEM-MAIS) Diode: A Novel Hybrid Device for ESD Protection

  • Author

    Acquaviva, D. ; Tsamados, D. ; Coronel, Ph ; Skotnicki, T. ; Ionescu, A.M.

  • Author_Institution
    Ecole Polytech. Fed. de Lausanne, Lausanne
  • fYear
    2009
  • fDate
    25-29 Jan. 2009
  • Firstpage
    132
  • Lastpage
    135
  • Abstract
    In this paper we propose and experimentally validate the concept of Microelectromechanical Metal-Air-Insulator-Semiconductor Diode (MEM-MAIS) as a novel hybrid device for ESD protection fabricated on SOI. The proposed ESD switch has unique figures of merit inherited from the MEM part: the in-series air gap guaranties record low leakage current (~10f A/mum) practically independent on temperature up to 100degC in off-state and a parasitic capacitance of few fF. The scalable electro-mechanical design of the actuation voltage makes the new proposed switch suitable for voltage domains ranging from few volts to tens of volts. A Fowler-Nordheim conduction is demonstrated for the on-state of the MEM-MAIS diode. Basic ESD HBM and MM experiments with MEM-MAIS diodes are reported and the versatility of the new device demonstrated.
  • Keywords
    air insulation; electrostatic discharge; microswitches; semiconductor diodes; silicon-on-insulator; ESD protection; Fowler-Nordheim conduction; SOI; figures of merit; low leakage current; microelectromechanical metal-air-insulator-semiconductor diode; parasitic capacitance; scalable electromechanical design; silicon-on-insulator; Biomembranes; Circuits; Diodes; Electrostatic discharge; Leakage current; Parasitic capacitance; Protection; Silicon on insulator technology; Switches; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
  • Conference_Location
    Sorrento
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-2977-6
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2009.4805336
  • Filename
    4805336