DocumentCode
3042846
Title
A Wafer-Level Micro Mechanical Global Shutter for a Micro Camera
Author
Kim, Che-Heung ; Jung, Kyu-Dong ; Kim, Woonbae
Author_Institution
CTO-SAIT, Samsung Electron. Co., Ltd., Yongin
fYear
2009
fDate
25-29 Jan. 2009
Firstpage
156
Lastpage
159
Abstract
A novel wafer-level manufactured micro mechanical global shutter utilizing thin-film roll actuators is presented for a micro mobile camera. The aperture of the shutter is 2.2 mm in diameter and covered with 36 triangular roll actuators whose radius of curvature is designed to 235 mum. The stress induced rolling of thin composite layers and their pull-in behaviors are analyzed and experimented. A 0.8 mm-thick wafer-level shutter array is successfully implemented using batch processes. The fabricated shutter can follows 500 Hz-square wave signal of 30 V.
Keywords
cameras; micromechanical devices; optical elements; frequency 500 Hz; micro mobile camera; size 0.8 mm; size 2.2 mm; thin composite layer; triangular roll actuators; voltage 30 V; wafer level micro mechanical global shutter; Actuators; Aluminum; Apertures; Cameras; Electrodes; Lenses; Manufacturing; Stress; Switches; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
Conference_Location
Sorrento
ISSN
1084-6999
Print_ISBN
978-1-4244-2977-6
Electronic_ISBN
1084-6999
Type
conf
DOI
10.1109/MEMSYS.2009.4805342
Filename
4805342
Link To Document