• DocumentCode
    3042846
  • Title

    A Wafer-Level Micro Mechanical Global Shutter for a Micro Camera

  • Author

    Kim, Che-Heung ; Jung, Kyu-Dong ; Kim, Woonbae

  • Author_Institution
    CTO-SAIT, Samsung Electron. Co., Ltd., Yongin
  • fYear
    2009
  • fDate
    25-29 Jan. 2009
  • Firstpage
    156
  • Lastpage
    159
  • Abstract
    A novel wafer-level manufactured micro mechanical global shutter utilizing thin-film roll actuators is presented for a micro mobile camera. The aperture of the shutter is 2.2 mm in diameter and covered with 36 triangular roll actuators whose radius of curvature is designed to 235 mum. The stress induced rolling of thin composite layers and their pull-in behaviors are analyzed and experimented. A 0.8 mm-thick wafer-level shutter array is successfully implemented using batch processes. The fabricated shutter can follows 500 Hz-square wave signal of 30 V.
  • Keywords
    cameras; micromechanical devices; optical elements; frequency 500 Hz; micro mobile camera; size 0.8 mm; size 2.2 mm; thin composite layer; triangular roll actuators; voltage 30 V; wafer level micro mechanical global shutter; Actuators; Aluminum; Apertures; Cameras; Electrodes; Lenses; Manufacturing; Stress; Switches; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
  • Conference_Location
    Sorrento
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-2977-6
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2009.4805342
  • Filename
    4805342