• DocumentCode
    3048638
  • Title

    Etching Processes of Carbon Nanowalls Using Dual-frequency Parallel-plate Capacitively Coupled Plasma

  • Author

    Kondo, Shingo ; Noda, Akio ; Yamakawa, Koji ; Den, Shoji ; Hiramatsu, Mineo ; Hori, Masaru

  • Author_Institution
    Nagoya Univ., Nagoya
  • fYear
    2007
  • fDate
    5-8 Nov. 2007
  • Firstpage
    162
  • Lastpage
    163
  • Abstract
    Carbon nanowalls (CNWs) is synthesized using the radical injection plasma enhanced chemical vapor deposition (CVD) system. In the initial growth process of CNWs on a Si substrate fabricated by the system, the carbon thin film of approximately 10 nm in thickness is deposited for 1 minute before CNWs grow in the vertical direction. The thin film is etched by using dual-frequency parallel-plate capacitively coupled plasma. SEM images characterise the CNWs. The etching rates of the CNWs and the carbon thin film are 150 nm/min and 15 nm/min, respectively. In order to extend applications of CNWs, the carbon thin film is removed from CNWs.
  • Keywords
    carbon; nanostructured materials; nanotechnology; plasma CVD; scanning electron microscopy; sputter etching; thin films; C; CVD; SEM; carbon nanowalls; carbon thin film; dual-frequency parallel-plate capacitively coupled plasma; etching; plasma enhanced chemical vapor deposition; size 10 nm; Argon; Chemical vapor deposition; Etching; Hydrogen; Material storage; Nanoscale devices; Plasma applications; Semiconductor thin films; Substrates; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microprocesses and Nanotechnology, 2007 Digest of papers
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-4-9902472-4-9
  • Type

    conf

  • DOI
    10.1109/IMNC.2007.4456154
  • Filename
    4456154