DocumentCode
3050221
Title
Deformation induced by residual stress during deposition process of lateral motion micro electrothermal actuators
Author
Lin, Meng-Ju ; Hwan, Chung-Li ; Lo, Chih-Ching ; Liao, Jung-Nan
Author_Institution
Feng Chia Univ., Taichung
fYear
2007
fDate
5-8 Nov. 2007
Firstpage
358
Lastpage
359
Abstract
Lateral motion micro thermal actuator is one of an important actuator for its large deformation and driving force. The lateral motion electrothermal actuator is often fabricated by surface micromachining. The out of plane deformation would be induced by residual stress, due to mismatch of thermal expansion coefficients between structure and sacrificial layers.Such deformation has advantage to overcome sticking problem during removing sacrificial layer by wet etching. From experiment results, the maximum deformation value depends on structure layer thickness and doping density. It can be considered the annealing process can diminish most residual stress in cold beam.
Keywords
actuators; annealing; deformation; etching; internal stresses; micromachining; annealing process; deformation; deposition process; lateral motion micro electrothermal actuators; residual stress; surface micromachining; thermal expansion coefficients; Actuators; Annealing; Doping; Electrothermal effects; Micromachining; Residual stresses; Thermal expansion; Thermal force; Thermal stresses; Wet etching;
fLanguage
English
Publisher
ieee
Conference_Titel
Microprocesses and Nanotechnology, 2007 Digest of papers
Conference_Location
Kyoto
Print_ISBN
978-4-9902472-4-9
Type
conf
DOI
10.1109/IMNC.2007.4456252
Filename
4456252
Link To Document