• DocumentCode
    3050221
  • Title

    Deformation induced by residual stress during deposition process of lateral motion micro electrothermal actuators

  • Author

    Lin, Meng-Ju ; Hwan, Chung-Li ; Lo, Chih-Ching ; Liao, Jung-Nan

  • Author_Institution
    Feng Chia Univ., Taichung
  • fYear
    2007
  • fDate
    5-8 Nov. 2007
  • Firstpage
    358
  • Lastpage
    359
  • Abstract
    Lateral motion micro thermal actuator is one of an important actuator for its large deformation and driving force. The lateral motion electrothermal actuator is often fabricated by surface micromachining. The out of plane deformation would be induced by residual stress, due to mismatch of thermal expansion coefficients between structure and sacrificial layers.Such deformation has advantage to overcome sticking problem during removing sacrificial layer by wet etching. From experiment results, the maximum deformation value depends on structure layer thickness and doping density. It can be considered the annealing process can diminish most residual stress in cold beam.
  • Keywords
    actuators; annealing; deformation; etching; internal stresses; micromachining; annealing process; deformation; deposition process; lateral motion micro electrothermal actuators; residual stress; surface micromachining; thermal expansion coefficients; Actuators; Annealing; Doping; Electrothermal effects; Micromachining; Residual stresses; Thermal expansion; Thermal force; Thermal stresses; Wet etching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microprocesses and Nanotechnology, 2007 Digest of papers
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-4-9902472-4-9
  • Type

    conf

  • DOI
    10.1109/IMNC.2007.4456252
  • Filename
    4456252