• DocumentCode
    3052591
  • Title

    On the study of skin-effect and dispersion of heavily lossy transmission lines

  • Author

    Pan, G. ; Zhu, X. ; Wang, B. ; Gilbert, B.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Wisconsin Univ., Milwaukee, WI, USA
  • fYear
    1992
  • fDate
    18-20 Mar 1992
  • Firstpage
    60
  • Lastpage
    63
  • Abstract
    A special case of a circular coaxial cable with heavy conduction loss was studied by full-wave analysis, and compared with the quasi-transverse electromagnetic (TEM) solutions. It was found that at high frequencies the tangential electrical fields will be much greater than the values reported in the literature. Despite relatively strong longitudinal E-fields and radial currents, the comparison revealed that, provided the circuit parameters are properly evaluated, the errors introduced by a simple distributed circuit model under the quasi-TEM assumption are not excessively large. Therefore, the telegraphist´s equations may give good results up to frequencies of 10 GHz or higher for transmission lines of small geometries commonly found in microelectronics packaging. A second case of three coupled microstrips of rectangular cross-section was also analyzed and compared with network measurements. It was found that the dispersion occurring in microelectronics packaging interconnects at frequencies up to the microwave band is anomalous
  • Keywords
    coaxial cables; coupled circuits; dispersion (wave); hybrid integrated circuits; skin effect; strip lines; transmission line theory; 0 to 10 GHz; MCM; circular coaxial cable; full-wave analysis; heavily lossy transmission lines; heavy conduction loss; high frequencies; longitudinal E-fields; microelectronics packaging; multichip modules; network measurements; quasi-TEM assumption; radial currents; rectangular cross-section; simple distributed circuit model; skin-effect; small geometries; tangential electrical fields; telegraphist´s equations; three coupled microstrips; Coaxial cables; Coupling circuits; Distributed parameter circuits; Electromagnetic analysis; Equations; Frequency; Geometry; Microelectronics; Microstrip; Packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE
  • Conference_Location
    Santa Cruz, CA
  • Print_ISBN
    0-8186-2725-5
  • Type

    conf

  • DOI
    10.1109/MCMC.1992.201447
  • Filename
    201447