DocumentCode
3052591
Title
On the study of skin-effect and dispersion of heavily lossy transmission lines
Author
Pan, G. ; Zhu, X. ; Wang, B. ; Gilbert, B.
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Wisconsin Univ., Milwaukee, WI, USA
fYear
1992
fDate
18-20 Mar 1992
Firstpage
60
Lastpage
63
Abstract
A special case of a circular coaxial cable with heavy conduction loss was studied by full-wave analysis, and compared with the quasi-transverse electromagnetic (TEM) solutions. It was found that at high frequencies the tangential electrical fields will be much greater than the values reported in the literature. Despite relatively strong longitudinal E-fields and radial currents, the comparison revealed that, provided the circuit parameters are properly evaluated, the errors introduced by a simple distributed circuit model under the quasi-TEM assumption are not excessively large. Therefore, the telegraphist´s equations may give good results up to frequencies of 10 GHz or higher for transmission lines of small geometries commonly found in microelectronics packaging. A second case of three coupled microstrips of rectangular cross-section was also analyzed and compared with network measurements. It was found that the dispersion occurring in microelectronics packaging interconnects at frequencies up to the microwave band is anomalous
Keywords
coaxial cables; coupled circuits; dispersion (wave); hybrid integrated circuits; skin effect; strip lines; transmission line theory; 0 to 10 GHz; MCM; circular coaxial cable; full-wave analysis; heavily lossy transmission lines; heavy conduction loss; high frequencies; longitudinal E-fields; microelectronics packaging; multichip modules; network measurements; quasi-TEM assumption; radial currents; rectangular cross-section; simple distributed circuit model; skin-effect; small geometries; tangential electrical fields; telegraphist´s equations; three coupled microstrips; Coaxial cables; Coupling circuits; Distributed parameter circuits; Electromagnetic analysis; Equations; Frequency; Geometry; Microelectronics; Microstrip; Packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE
Conference_Location
Santa Cruz, CA
Print_ISBN
0-8186-2725-5
Type
conf
DOI
10.1109/MCMC.1992.201447
Filename
201447
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