• DocumentCode
    3052715
  • Title

    Delay macromodels for point-to-point MCM interconnections

  • Author

    Kayssi, Ayman I. ; Sakallah, Karem A.

  • Author_Institution
    Dept. of Electr. Eng. & Comput Sci., Michigan Univ., Ann Arbor, MI, USA
  • fYear
    1992
  • fDate
    18-20 Mar 1992
  • Firstpage
    79
  • Lastpage
    82
  • Abstract
    Dimensional analysis is used to develop a macromodel for point-to-point multichip module (MCM) interconnect delay, which applies to lossless and lossy lines. The equation for lossless lines is linear and very simple; the equation for lossy lines is quadratic. In terms of computational costs, the evaluation of delay involves 24 multiplications, and is several orders of magnitude faster than using circuit simulation or transmission line analysis programs to calculate delays. Using the macromodel, the authors derived the dependence of delay on several technology parameters, and calculated the sensitivity of delay to the circuit parameters
  • Keywords
    hybrid integrated circuits; metallisation; modules; transmission line theory; MCM; computational costs; dimensional analysis; interconnect delay; lossless lines; lossy lines; macromodel; multichip modules; point-to-point interconnections; Capacitance; Capacitors; Delay effects; Distributed parameter circuits; Driver circuits; Equations; Impedance; Inductance; Integrated circuit interconnections; Semiconductor device modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE
  • Conference_Location
    Santa Cruz, CA
  • Print_ISBN
    0-8186-2725-5
  • Type

    conf

  • DOI
    10.1109/MCMC.1992.201452
  • Filename
    201452