Effect of humidity cycling on reliability of overlaid high density interconnects

Author

Shan, X. ; Agarwal, R.K. ; Pecht, M. ; Evans, John

Author_Institution

Maryland Univ., College Park, MD, USA

fYear

1992

fDate

18-20 Mar 1992

Firstpage

106

Lastpage

108

Abstract

The authors present a finite element simulation, performed to observe the stresses generated in a typical high-density interconnect structure as a result of swelling mismatches due to water absorption. They focus on stresses which could cause de-adhesion and microbuckling of dielectric films due to humidity cycling. Numerical analysis was used to examine the potential failure sites, modes, and failure mechanisms

Keywords

circuit reliability; environmental degradation; failure analysis; finite element analysis; humidity; hybrid integrated circuits; integrated circuit technology; numerical analysis; packaging; simulation; swelling; HDI; MCM; de-adhesion; dielectric films; failure mechanisms; failure modes; failure sites; finite element simulation; high density interconnects; humidity cycling; microbuckling; multichip modules; overlaid interconnects; reliability; swelling mismatches; water absorption; Bonding; Compressive stress; Copper; Delamination; Dielectric constant; Dielectric substrates; Humidity; Metallization; Polyimides; Thermal stability;

fLanguage

English

Publisher

ieee

Conference_Titel

Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE

Conference_Location

Santa Cruz, CA

Print_ISBN

0-8186-2725-5

Type

conf

DOI

10.1109/MCMC.1992.201459

Filename

201459