DocumentCode
3053349
Title
Pipelined parallel test structure for mixed-signal SoCs
Author
Jin, Yang ; Wang, Hong ; Lv, Zhengliang ; Yang, Shiyuan
Author_Institution
Dept. of Autom., Tsinghua Univ., Beijing, China
fYear
2010
fDate
24-28 May 2010
Firstpage
256
Lastpage
256
Abstract
Testing of mixed-signal SoCs becomes one of the pressing challenges due to enormous test cost including ATE expenses, design for test (DFT) hardware overhead and test application time. Prior researches focus mainly on minimizing test cost for digital SoCs under the constraint of ATE test resources and power consumption. A self-hold analog test wrapper design and pipelined parallel test manner are proposed in this paper to realize both core-level and system-level parallel test for low to mid-frequency analog cores in mixed-signal SoCs.
Keywords
design for testability; system-on-chip; core-level parallel test; design for test hardware overhead; enormous test cost; mixed signal SoC; pipelined parallel test structure; self-hold analog test wrapper design; system-level parallel test; system-on-chip; test application time; Automatic testing; Circuit testing; Costs; Design automation; Design for testability; Energy consumption; Hardware; Pressing; Signal generators; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Symposium (ETS), 2010 15th IEEE European
Conference_Location
Praha
ISSN
1530-1877
Print_ISBN
978-1-4244-5834-9
Electronic_ISBN
1530-1877
Type
conf
DOI
10.1109/ETSYM.2010.5512737
Filename
5512737
Link To Document