DocumentCode
3053848
Title
New View Requirements for Analogue/MS IPs for Dependability Optimization in Heterogeneous SoC Design
Author
Kerkhoff, Hans G.
Author_Institution
Testable Design & Test of Integrated Syst. (TDT) Group, Univ. of Twente, Enschede, Netherlands
fYear
2011
fDate
16-18 May 2011
Firstpage
1
Lastpage
6
Abstract
Nowadays, safety-critical systems in for instance the automotive industry routinely consist of complex Systems-on-Chip in increasingly advanced processes. The decreased reliability for advanced processes, along with the harsh environmental conditions in cars, causes serious concerns for the dependability of those SoCs. For this reason, some digital IP vendors for those systems are already starting to incorporate additional information on IPs to system designers, for instance to include safety parameters. This provides system designers with a possibility to optimize/guarantee their design along an additional design axis (e.g. safety). As most automotive SoCs incorporate analogue front/back-ends, a similar requirement would also have to be included for analogue/mixed-signal IPs. Because of limited robustness, and a variety of parameters, this has not been considered for analogue/mixed-signal IPs yet. This paper presents a first step towards the introduction of a dependability view for analogue/mixed-signal IPs, and an investigation which benefits like increased dependability could be expected at system level.
Keywords
analogue circuits; automotive components; automotive electrics; integrated circuit design; logic circuits; microprocessor chips; system-on-chip; analogue IP; analogue-MS IP; automotive SoC; dependability optimization; digital IP vendor; heterogeneous SoC design; mixed signal IP; Automotive engineering; Availability; IP networks; Maintenance engineering; Safety; System-on-a-chip; MS-IP specification; availability; dependability; fault-tolerance; reliability; safety;
fLanguage
English
Publisher
ieee
Conference_Titel
Mixed-Signals, Sensors and Systems Test Workshop (IMS3TW), 2011 IEEE 17th International
Conference_Location
Santa Barbara, CA
Print_ISBN
978-1-4577-1144-2
Type
conf
DOI
10.1109/IMS3TW.2011.22
Filename
6132727
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