• DocumentCode
    3054050
  • Title

    The mechanical and thermal properties of alumina filled epoxy

  • Author

    Rashid, Erfan Suryani Abdul ; Akil, Hazizan Md ; Ariffin, Kamarshah ; Kooi, Chee Choong

  • Author_Institution
    Univ. Sains Malaysia, Pulau Pinang
  • fYear
    2007
  • fDate
    8-10 Nov. 2007
  • Firstpage
    282
  • Lastpage
    287
  • Abstract
    This article describes the thermal and mechanical behavior of alumina-filled epoxy composites. The epoxy matrix was reinforced with increasing amount of alumina particles in the range of 10-30% by weight using resin transfer molding technique. From the flexural test results, it was observed that the flexural modulus increases with increasing a-alumina content from 10 to 30 wt% with 30 wt% of a-alumina content recorded the highest value of flexural modulus. The DMA result reveals that the highest glass transition temperature (Tg) was recorded at 30 wt% alumina content. It was also found that the 30 wt% alumina content recorded the highest value of storage modulus. The weight loss profile and thermal stability from TGA results show that the thermal stability increases with increasing alumina content. The morphology of the fracture surface also be studied using FESEM.
  • Keywords
    alumina; composite materials; mechanical properties; scanning electron microscopy; surface morphology; thermal analysis; thermal properties; transfer moulding; Al2O3; DMA; FESEM; TGA; alumina filled epoxy composites; flexural modulus; fracture surface morphology; glass transition temperature; mechanical properties; resin transfer molding; thermal properties; thermal stability; Electronic packaging thermal management; Electronics industry; Electronics packaging; Manufacturing industries; Mechanical factors; Organic materials; Scanning electron microscopy; Testing; Thermal stability; Thermal stresses; DMA; Flexural modulus; TGA; alumina filled epoxy composites;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Manufacturing and Technology, 31st International Conference on
  • Conference_Location
    Petaling Jaya
  • ISSN
    1089-8190
  • Print_ISBN
    978-1-4244-0730-9
  • Electronic_ISBN
    1089-8190
  • Type

    conf

  • DOI
    10.1109/IEMT.2006.4456467
  • Filename
    4456467