DocumentCode
3054839
Title
Characterization of Robust Alignment Mark to Improve Alignment Performance
Author
Ahmad, Normah ; Hashim, Uda ; Manaf, Mohd Jeffery ; Ibrahim, Kader
Author_Institution
Kolej Univ. Kejuruteraan Utara Malaysia, Kangar
fYear
2007
fDate
8-10 Nov. 2007
Firstpage
518
Lastpage
523
Abstract
Overlay requirement is one of the biggest obstacles in achieving a very small feature. With the continued growth of small feature size, overlay requirement becomes tighter. Such a tight requirement requires a very high performance in alignment. Alignment performance is greatly dependent on alignment signal quality. Variation in metal deposition thickness, polishing time, and mark depth may deteriorate the alignment signals quality. In this paper, different types of alignment mark was used to evaluate the alignment performance in various process environment. Based from the findings, two grating alignment mark gives the worst alignment performance, which clearly indicates the unsuitability to use in production environment.
Keywords
integrated circuit technology; quality control; alignment performance; alignment signal quality; grating alignment mark; metal deposition thickness; overlay requirement; polishing time; production environment; robust alignment mark characterization; Gratings; Manufacturing; Maxwell equations; Microelectronics; Numerical analysis; Production; Robustness; Signal generators; Signal processing; Silicon; Alignment; Alignment Mark; Alignment Performance; Alignment Signal; Overlay;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing and Technology, 31st International Conference on
Conference_Location
Petaling Jaya
ISSN
1089-8190
Print_ISBN
978-1-4244-0730-9
Electronic_ISBN
1089-8190
Type
conf
DOI
10.1109/IEMT.2006.4456505
Filename
4456505
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