• DocumentCode
    3054839
  • Title

    Characterization of Robust Alignment Mark to Improve Alignment Performance

  • Author

    Ahmad, Normah ; Hashim, Uda ; Manaf, Mohd Jeffery ; Ibrahim, Kader

  • Author_Institution
    Kolej Univ. Kejuruteraan Utara Malaysia, Kangar
  • fYear
    2007
  • fDate
    8-10 Nov. 2007
  • Firstpage
    518
  • Lastpage
    523
  • Abstract
    Overlay requirement is one of the biggest obstacles in achieving a very small feature. With the continued growth of small feature size, overlay requirement becomes tighter. Such a tight requirement requires a very high performance in alignment. Alignment performance is greatly dependent on alignment signal quality. Variation in metal deposition thickness, polishing time, and mark depth may deteriorate the alignment signals quality. In this paper, different types of alignment mark was used to evaluate the alignment performance in various process environment. Based from the findings, two grating alignment mark gives the worst alignment performance, which clearly indicates the unsuitability to use in production environment.
  • Keywords
    integrated circuit technology; quality control; alignment performance; alignment signal quality; grating alignment mark; metal deposition thickness; overlay requirement; polishing time; production environment; robust alignment mark characterization; Gratings; Manufacturing; Maxwell equations; Microelectronics; Numerical analysis; Production; Robustness; Signal generators; Signal processing; Silicon; Alignment; Alignment Mark; Alignment Performance; Alignment Signal; Overlay;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Manufacturing and Technology, 31st International Conference on
  • Conference_Location
    Petaling Jaya
  • ISSN
    1089-8190
  • Print_ISBN
    978-1-4244-0730-9
  • Electronic_ISBN
    1089-8190
  • Type

    conf

  • DOI
    10.1109/IEMT.2006.4456505
  • Filename
    4456505