• DocumentCode
    3055272
  • Title

    3D microwave modules for space applications

  • Author

    Monfraix, P. ; Ulian, P. ; Drevon, C. ; George, S. ; Vera, A.C. ; Tronche, C. ; Cazaux, J.L. ; Llopis, O. ; Graffeuil, J.

  • Author_Institution
    Alcatel Espace, Toulouse, France
  • Volume
    3
  • fYear
    1998
  • fDate
    7-12 June 1998
  • Firstpage
    1289
  • Abstract
    This paper describes the design, manufacturing and measurement of 3D microwave modules. The vertical interconnection between stacked circuits is based on an shielded homogeneous coplanar line with a 90/spl deg/ vertical structure. The fabrication of these modules is in relation with the "MultiChip Module Vertical" technology, originally developed for digital applications. The electrical measurement in the Ku-band demonstrates very good results.
  • Keywords
    aerospace; microwave circuits; modules; packaging; 3D microwave modules; Ku-band; fabrication; manufacturing; shielded homogeneous coplanar line; space applications; stacked circuits; vertical interconnection; Dielectric substrates; Extraterrestrial measurements; Frequency; Integrated circuit interconnections; Microwave devices; Microwave measurements; Microwave technology; Performance evaluation; Pulp manufacturing; Stacking;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 1998 IEEE MTT-S International
  • Conference_Location
    Baltimore, MD, USA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-4471-5
  • Type

    conf

  • DOI
    10.1109/MWSYM.1998.700610
  • Filename
    700610
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3055272