DocumentCode
3056466
Title
Modeling heat transfer and liquid flow in micro-channels
Author
Sabry, M.N. ; Djebedjian, B.O. ; Saleh, S.H. ; Mahgoub, M.M.
Author_Institution
Univ. Franqaise d´´Egypte, Cairo, Egypt
fYear
2004
fDate
2004
Firstpage
511
Lastpage
518
Abstract
The use of micro-channels in order to cool modern high speed electronic circuits is one of the techniques frequently adopted in current practice. A burst of publications in this area has been observed in the last decade. However, modeling of fluid flow and heat transfer in micro-channels is still an open problem. In fact, many deviations have been experimentally observed between well established correlations used for conventional normally sized channels and the behavior of microchannels. These deviations increase as the channel size decreases. In this work, observed experimental deviations are first listed, followed by a critical review of different hypotheses advanced in the literature to explain them. One of these hypotheses is thoroughly developed in order to build a model that explains both the orders of magnitudes and the trends of observed phenomena.
Keywords
channel flow; circuit simulation; cooling; flow simulation; high-speed integrated circuits; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; thermal analysis; thermal management (packaging); channel size; fluid flow; heat transfer modeling; high speed electronic circuits cooling; liquid flow modeling; micro-channels; Chemical technology; Circuits; Fluid flow; Friction; Heat transfer; Hydraulic diameter; Modems; Shape; Temperature; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on
Print_ISBN
0-7803-8420-2
Type
conf
DOI
10.1109/ESIME.2004.1304085
Filename
1304085
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