• DocumentCode
    3058132
  • Title

    HMM with explicit state duration for prognostics in face milling

  • Author

    Yue, Wu ; Hong, G.S. ; Wong, Y.S.

  • Author_Institution
    Mech. Eng., Nat. Univ. of Singapore, Singapore, Singapore
  • fYear
    2010
  • fDate
    28-30 June 2010
  • Firstpage
    218
  • Lastpage
    223
  • Abstract
    In this paper, the development of hidden Markov model with explicit state duration (Variable duration HMM) for face milling residual life distribution prognostics is presented. An HMM with explicit state duration is constructed by involving explicit state duration probability. The HMM with explicit state duration offers significant advantages over the conventional HMM in prognostics. The reason why including explicit duration has been both verified theoretically and experimentally in this paper. Moreover, two types of state duration pdf (Gaussian and Weibull distribution) have also been studied. VDHMM based prognostics is demonstrated with the case study which is face milling application. In the case study, the mean residual life calculated from both conventional HMM and VDHMM has been compared with the natural mean residual life. The results of the case study has shown that including the state duration as both Gaussian and Weibull distribution perform better than the conventional HMM.
  • Keywords
    Gaussian distribution; Weibull distribution; hidden Markov models; milling; probability; Gaussian distribution; Weibull distribution; explicit state duration probability; face milling; residual life distribution prognostics; variable duration hidden Markov model; Condition monitoring; Error analysis; Exponential distribution; Gaussian distribution; Handwriting recognition; Hidden Markov models; Mechanical engineering; Milling; Speech recognition; Weibull distribution; hidden Markov model; prognostics; tool condition monitoring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Robotics Automation and Mechatronics (RAM), 2010 IEEE Conference on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-6503-3
  • Type

    conf

  • DOI
    10.1109/RAMECH.2010.5513187
  • Filename
    5513187