• DocumentCode
    3073942
  • Title

    Circuit and silicide impact on the correlation between TLP and ESD (HBM and MM)

  • Author

    Huang, S.C. ; Lee, J.H. ; Lee, S.C. ; Chen, K.M. ; Song, M.H. ; Chiang, C.Y. ; Chang, Mi-Chang

  • Author_Institution
    Taiwan Semicond. Manuf. Co., Hsin Chu, Taiwan
  • fYear
    2004
  • fDate
    18-21 Oct. 2004
  • Firstpage
    169
  • Lastpage
    172
  • Abstract
    Transmission line pulse (TLP) measurements have been shown to correlate well with ESD performance in most cases. However, some recent researches suggested in some cases miscorrelation can happen. A test chip was designed and fabricated in TSMC 0.13 μm technology to test this correlation. We found that in some conditions, TLP measurements (IT2) do not correlate well with ESD testing in both human body and machine models.
  • Keywords
    correlation methods; electrostatic discharge; integrated circuit testing; semiconductor device testing; 0.13 mm; ESD performance; ESD testing; HBM; IT2; MM; TLP-ESD correlation; human body models; machine models; transmission line pulse measurement; Circuit testing; Current measurement; Driver circuits; Electrostatic discharge; Equations; Inverters; MOS devices; Protection; Silicides; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 2004 IEEE International
  • Print_ISBN
    0-7803-8517-9
  • Type

    conf

  • DOI
    10.1109/IRWS.2004.1422766
  • Filename
    1422766
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3073942