DocumentCode
3073949
Title
Creep Corrosion occurrence on TQFP IC package
Author
Chen, Ci
Author_Institution
Integrated Service Technol., Inc., Hsinchu, Taiwan
fYear
2012
fDate
24-26 Oct. 2012
Firstpage
149
Lastpage
158
Abstract
Creep Corrosion is the common factor to cause electronic products failed. Cloud Computing is getting more and more popular in recent years so people´s daily life correlate closely to Cloud Computing. Many global companies built the huge data center in different countries. The challenges Cloud Computing facing are Transmission Technology, Cooling System, Energy Consumption and Air Pollution. Also, Creep Corrosion is a big concern to Cloud Computing. In this study, creep corrosion occurrence on IC Package is investigated.
Keywords
cloud computing; corrosion; creep; electronics packaging; TQFP IC package; air pollution; cloud computing; cooling system; creep corrosion occurrence; electronic products; energy consumption; transmission technology; Cloud computing; Copper; Corrosion; Creep; Integrated circuits; Lead; Tin; 3D OM; Creep Corrosion; Mixed Flowing Gas Test (MFG); Organic Acid Flux; Rosin Flux; SEM/EDX; X-Section;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4673-1635-4
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2012.6420283
Filename
6420283
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