• DocumentCode
    3078156
  • Title

    Separate poling of inclusions and matrix in PT/P(VDF-TrFE) 0-3 composites

  • Author

    Ploss, B. ; Ploss, B. ; Shin, F.G. ; Chan, H.L.W. ; Choy, C.L.

  • Author_Institution
    Dept. of Appl. Phys., Hong Kong Polytech. Univ., Hung Hom, Hong Kong
  • fYear
    1998
  • fDate
    1998
  • Firstpage
    299
  • Lastpage
    302
  • Abstract
    A procedure for separate poling of the ceramic particles and the copolymer matrix of 0-3 composites has been developed. 2.5 μm thick films of 56/44 mol-% vinylidene fluoride-trifluoroethylene (P(VDF-TrFE)) copolymer embedded with 8 volume% lead titanate (PT) ceramic particles were investigated. First, the ceramic particles in the composite are polarized under a DC-field at temperatures above the Curie temperature of the copolymer. In the second step the P(VDF-TrFE) matrix is poled at room temperature in an AC-field at a frequency of 1 Hz. The degree of poling of the composite is then investigated by the measurement of the second order permittivity and the pyroelectric coefficient over a temperature range covering the ferroelectric and paraelectric phase of the copolymer matrix. The results show that the polarization of the ceramic is unchanged by the subsequent AC poling of the copolymer matrix
  • Keywords
    composite materials; dielectric polarisation; ferroelectric Curie temperature; ferroelectric ceramics; filled polymers; lead compounds; permittivity; polymer blends; 1 Hz; 2.5 mum; AC poling; Curie temperature; PT/P(VDF-TrFE) 0-3 composites; PbTiO3; ceramic particles; copolymer matrix; degree of poling; inclusions; paraelectric phase; pyroelectric coefficient; second order permittivity; separate poling; Ceramics; Ferroelectric materials; Frequency measurement; Permittivity measurement; Phase measurement; Polarization; Pyroelectricity; Temperature distribution; Thick films; Titanium compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applications of Ferroelectrics, 1998. ISAF 98. Proceedings of the Eleventh IEEE International Symposium on
  • Conference_Location
    Montreux
  • ISSN
    1099-4734
  • Print_ISBN
    0-7803-4959-8
  • Type

    conf

  • DOI
    10.1109/ISAF.1998.786693
  • Filename
    786693