• DocumentCode
    3078420
  • Title

    Cross-Layer SLA Management for Cloud-hosted Big Data Analytics Applications

  • Author

    Xuezhi Zeng ; Ranjan, Rajiv ; Strazdins, Peter ; Garg, Saurabh Kumar ; Lizhe Wang

  • Author_Institution
    Australian Nat. Univ., Canberra, ACT, Australia
  • fYear
    2015
  • fDate
    4-7 May 2015
  • Firstpage
    765
  • Lastpage
    768
  • Abstract
    As we come to terms with various big data challenges, one vital issue remains largely untouched. That is service level agreement (SLA) management to deliver strong Quality of Service (QoS) guarantees for big data analytics applications (BDAA) sharing the same underlying infrastructure, for example, a public cloud platform. Although SLA and QoS are not new concepts as they originated much before the cloud computing and big data era, its importance is amplified and complexity is aggravated by the emergence of time-sensitive BDAAs such as social network-based stock recommendation and environmental monitoring. These applications require strong QoS guarantees and dependability from the underlying cloud computing platform to accommodate real-time responses while handling ever-increasing complexities and uncertainties. Hence, the over-reaching goal of this PhD research is to develop novel simulation, modelling and benchmarking tools and techniques that can aid researchers and practitioners in studying the impact of uncertainties (contention, failures, anomalies, etc.) on the final SLA and QoS of a cloud-hosted BDAA.
  • Keywords
    Big Data; cloud computing; contracts; data analysis; quality of service; BDAA; QoS; big data analytics applications; cloud-hosted big data analytics; cross-layer SLA management; quality of service; service level agreement; Best practices; Big data; Cloud computing; Computers; Conferences; Grid computing; Real-time systems; Big Data; Cloud Computing; Service Level Agreement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Cluster, Cloud and Grid Computing (CCGrid), 2015 15th IEEE/ACM International Symposium on
  • Conference_Location
    Shenzhen
  • Type

    conf

  • DOI
    10.1109/CCGrid.2015.175
  • Filename
    7152552