DocumentCode
3081938
Title
A new design of high power LED module with glass encapsulation toward high stability
Author
Huang, Shun-Yuan ; Chen, Yu-Chia ; Wang, Jau-Sheng
Author_Institution
Dept. of Photonics, Nat. Sun Yat-sen Univ., Kaohsiung, Taiwan
fYear
2012
fDate
2-6 July 2012
Firstpage
611
Lastpage
612
Abstract
In this paper we developed a new type of glass encapsulation LED module which potentially provides higher reliability at higher power.
Keywords
encapsulation; light emitting diodes; reliability; glass encapsulation; high power LED module; high power reliability; high power stability; Encapsulation; Glass; Heat sinks; Light emitting diodes; Ocean temperature; Substrates; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Opto-Electronics and Communications Conference (OECC), 2012 17th
Conference_Location
Busan
ISSN
2166-8884
Print_ISBN
978-1-4673-0976-9
Electronic_ISBN
2166-8884
Type
conf
DOI
10.1109/OECC.2012.6276754
Filename
6276754
Link To Document