Wire-length distribution of three-dimensional integrated circuits

Author

Nahman, A. ; Fan, Andy ; Chung, James ; Reif, Rafael

Author_Institution

Microsystems Technol. Lab., MIT, Cambridge, MA, USA

fYear

1999

fDate

1999

Firstpage

233

Lastpage

235

Abstract

In this paper, the wire (interconnect)-length distribution of three-dimensional (3D) integrated circuits is derived following the methodology used to estimate two-dimensional wire-length distribution (Davis et al, 1998). It is found that 3D integration results in a narrower wire-length distribution with a higher number of local wires and fewer global wires than 2D integration. The impact of 3D integration on system performance is discussed

Keywords

VLSI; circuit CAD; circuit simulation; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; integrated circuit modelling; 2D integration; 2D wire-length distribution estimation methodology; 3D ICs; 3D integrated circuits; 3D integration; global wires; interconnect wire-length distribution; local wires; system performance; wire-length distribution; Delay; Integrated circuit interconnections; Integrated circuit technology; Logic circuits; Logic gates; Niobium; System performance; Three-dimensional integrated circuits; Very large scale integration; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Interconnect Technology, 1999. IEEE International Conference

Conference_Location

San Francisco, CA

Print_ISBN

0-7803-5174-6

Type

conf

DOI

10.1109/IITC.1999.787131

Filename

787131