• DocumentCode
    3085970
  • Title

    I-V-T studies on ternary silicide Co1-xNixSi2/n-Si Schottky contacts

  • Author

    Zhu, Shiyang ; Ru, Guoping ; Qu, Xinping ; Van Meirhaeghe, R.L. ; Forment, S. ; Li, Bingzong

  • Author_Institution
    Dept. of Microelectron., Fudan Univ., Shanghai, China
  • fYear
    2004
  • fDate
    15-16 March 2004
  • Firstpage
    155
  • Lastpage
    158
  • Abstract
    Ternary silicide Co1-xNixSi2/n-Si(100) contacts with different x value were formed by solid phase reaction of Co/Ni bilayer and substrate Si. Their Schottky barrier properties were studied using the current voltage-temperature (I-V-T) measurements range from 100 to 300K. The I-V-T curves show three typical types, which can be related to the barrier height inhomogeneity. A clean trend is found that the barrier height inhomogeneity increases with increasing the annealing temperature. Ni incorporation reduces not only the silicidation temperature, but also the temperature at which the contact becomes inhomogeneity.
  • Keywords
    Schottky barriers; VLSI; annealing; cobalt compounds; elemental semiconductors; nickel compounds; silicon; 100 to 300 K; Co1-xNixSi2-Si; I-V-T studies; Schottky barrier; barrier height inhomogeneity; solid phase reaction; ternary silicide Co1-xNixSi2/N-Si Schottky contacts; Annealing; Conductivity; Current measurement; Electrical resistance measurement; Fabrication; Nickel; Schottky barriers; Silicides; Temperature distribution; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Junction Technology, 2004. IWJT '04. The Fourth International Workshop on
  • Print_ISBN
    0-7803-8191-2
  • Type

    conf

  • DOI
    10.1109/IWJT.2004.1306782
  • Filename
    1306782