DocumentCode
3087566
Title
Low-temperature die attach material
Author
Smith, Charles ; Le, Kim ; Herrington, Tom ; Jeng, J.S. ; Akhtar, Masyood
Author_Institution
Johnson Matthey Inc., San Diego, CA, USA
fYear
1992
fDate
18-20 May 1992
Firstpage
234
Lastpage
238
Abstract
Describes the development of glasses for silver glass die attach application at temperature below 400° and as low as 260°C. It is observed that the basic principle of the nonbridging oxygen formulation mechanism can be used to design glasses in the development of new silver glass composites. These new composites were shown to perform at lower application temperatures with similar or better reliability than the original lead borate glass based silver composite. It was demonstrated that glass composition, glass transition temperature, and glass crystallization behavior were key to the ultimate performance of the composite
Keywords
circuit reliability; composite materials; glass; packaging; silver; 260 to 400 degC; application temperatures; die attach application; glass composition; glass crystallization; glass transition temperature; reliability; Bonding; Crystallization; Glass; Microassembly; Packaging machines; Semiconductor device packaging; Silicon; Silver; Temperature; Viscosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location
San Diego, CA
Print_ISBN
0-7803-0167-6
Type
conf
DOI
10.1109/ECTC.1992.204212
Filename
204212
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