• DocumentCode
    3087566
  • Title

    Low-temperature die attach material

  • Author

    Smith, Charles ; Le, Kim ; Herrington, Tom ; Jeng, J.S. ; Akhtar, Masyood

  • Author_Institution
    Johnson Matthey Inc., San Diego, CA, USA
  • fYear
    1992
  • fDate
    18-20 May 1992
  • Firstpage
    234
  • Lastpage
    238
  • Abstract
    Describes the development of glasses for silver glass die attach application at temperature below 400° and as low as 260°C. It is observed that the basic principle of the nonbridging oxygen formulation mechanism can be used to design glasses in the development of new silver glass composites. These new composites were shown to perform at lower application temperatures with similar or better reliability than the original lead borate glass based silver composite. It was demonstrated that glass composition, glass transition temperature, and glass crystallization behavior were key to the ultimate performance of the composite
  • Keywords
    circuit reliability; composite materials; glass; packaging; silver; 260 to 400 degC; application temperatures; die attach application; glass composition; glass crystallization; glass transition temperature; reliability; Bonding; Crystallization; Glass; Microassembly; Packaging machines; Semiconductor device packaging; Silicon; Silver; Temperature; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1992. Proceedings., 42nd
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    0-7803-0167-6
  • Type

    conf

  • DOI
    10.1109/ECTC.1992.204212
  • Filename
    204212