Process characterization of a low-temperature, silver-glass die attach material using thermogravimetric analysis

Describes a novel method of process characterization for single step firing of a resin-free silver-glass die attach material. Thermogravimetric analysis (TGA) equipment is utilized in a unique manner which allows offline characterization of the die attach material for specific die sizes. In this way the process engineer can establish the firing process for the material which will completely remove all organics in the shortest possible time, thus maximizing product throughput and equipment utilization. The results for the TGA studies are then translated to profiles on a belt furnace for a real-life assessment of the die attachment integrity