Packaging a 150-W bipolar ECL microprocessor

Author

Hamburgen, William R. ; Fitch, John S.

Author_Institution

Digital Equipment Corp., Palo Alto, CA, USA

fYear

1992

fDate

18-20 May 1992

Firstpage

412

Lastpage

422

Abstract

Recent developments in computer-aided design have made possible the highly automated layout of custom ECL (emitter coupled logic) circuits. These layouts have a much higher circuit and power density than gate array designs. It is now possible to place an entire ECL microprocessor, including floating point unit and cache memory, on one large die. To demonstrate the capability of supporting such a die, the authors built and tested low-cost, air-cooled single-chip packaging for a 12.6-mm×15.4-mm die. The PPGA (plastic pin grid array) package supplied the required current and maintained junction temperatures at less than 100°C while dissipating 150 W. This required innovation in five areas: die metalization, bondwire layout, PPGA package design, die attach, and cooling by a thermosiphon

Keywords

bipolar integrated circuits; cooling; emitter-coupled logic; integrated circuit technology; microprocessor chips; packaging; 100 degC; 150 W; PPGA; air-cooled; bipolar ECL microprocessor; bondwire layout; cooling; die attach; die metalization; emitter coupled logic; junction temperatures; package design; plastic pin grid array; single-chip packaging; thermosiphon; Cache memory; Circuit testing; Coupling circuits; Current supplies; Design automation; Electronics packaging; Logic circuits; Logic design; Microprocessors; Plastic packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1992. Proceedings., 42nd

Conference_Location

San Diego, CA

Print_ISBN

0-7803-0167-6

Type

conf

DOI

10.1109/ECTC.1992.204241

Filename

204241