Polyimide for thin film redistribution on glass-ceramic/copper multilevel substrates (ES9000 system)

Author

Czornyj, G. ; Chen, K.R. ; Prada-Silva, G. ; Arnold, A. ; Souleotis, H. ; Kim, S. ; Ree, M. ; Volksen, W. ; Dawson, D. ; DiPietro, R.

Author_Institution

IBM Technol. Products, Hopewell Junction, NY, USA

fYear

1992

fDate

18-20 May 1992

Firstpage

682

Lastpage

687

Abstract

In 1991 IBM introduced a glass-ceramic substrate with thin-film redistribution as the first level package utilizing copper thin-film technology. The authors describe the development of a unique and novel polyimide, a derivative of PMDA-ODA, used in this substrate. The synthesis, processing, and material characterization are described. The discussion emphasizes the experimental techniques developed to fully characterize thin films (10-20 μm thick) of polyimide to ensure the manufacturability and reliability of the thin-film redistribution

Keywords

IBM computers; hybrid integrated circuits; mainframes; multichip modules; polymer films; substrates; thin film circuits; 10 to 20 micron; Cu thin film technology; ES9000 system; first level package; glass-ceramic substrate; material characterization; multilevel substrates; polyimide; processing; synthesis; thin film redistribution; Adhesives; Copper; Dielectric thin films; Fabrication; Polyimides; Polymer films; Substrates; Thermal stresses; Transistors; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1992. Proceedings., 42nd

Conference_Location

San Diego, CA

Print_ISBN

0-7803-0167-6

Type

conf

DOI

10.1109/ECTC.1992.204278

Filename

204278