The effect of substrate materials on the thermo-mechanical behavior of multilayered structures

Author

Dunne, Rajiv C. ; Sitaraman, Suresh K.

Author_Institution

George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

1997

fDate

9-12 Mar 1997

Firstpage

134

Lastpage

138

Abstract

At the Packaging Research Center, research on a new MCM DL technology called “SLIM (Single Level Integrated Module)” is currently being pursued This consists of a multilayered substrate, which includes passive layers such as capacitor, inductor and resistor layers, in addition to the power, X-Y signal and ground layers. The present study focuses on predicting the substrate warpage and interfacial stress-strain distribution of this complex multilayered structure under uniform thermal loading. The effect of some key parameters such as base layer thickness, base layer material, interlayer dielectric material, and thermal load has been studied on an idealized model to understand the thermo-mechanical response of the substrate. Preliminary design/material recommendations are suggested for enhanced thermo-mechanical integrity of the integrated substrate

Keywords

ceramics; dielectric thin films; elastic moduli; finite element analysis; interface phenomena; laminates; multichip modules; plastic packaging; polymer films; stress-strain relations; substrates; thermal expansion; MCM DL technology; SLIM; X-Y signal layers; base layer material; base layer thickness; ceramic; enhanced thermo-mechanical integrity; epoxy-glass laminate; ground layers; idealized model; interfacial stress-strain distribution; interlayer dielectric material; multilayered structures; passive layers; polymer materials; power layers; single level integrated module; substrate materials effect; substrate warpage; thermo-mechanical behavior; uniform thermal loading; Dielectric substrates; Electronic packaging thermal management; Electronics packaging; Mechanical engineering; Shearing; Thermal expansion; Thermal loading; Thermal stresses; Thermomechanical processes; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials. Proceedings., 3rd International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-7803-3818-9

Type

conf

DOI

10.1109/ISAPM.1997.581277

Filename

581277