• DocumentCode
    3095416
  • Title

    Leakage inductance calculation for high power density converters applications

  • Author

    Blanchette, Handy Fortin ; Al-Haddad, Kamal

  • Author_Institution
    Ecole de Technol. Super., Montreal
  • fYear
    2007
  • fDate
    5-8 Nov. 2007
  • Firstpage
    1402
  • Lastpage
    1407
  • Abstract
    This work presents a complete procedure to compute the leakage inductance of high power density printed circuit board used in power electronic converters. By the magnetic field study, the proposed method gives an intuitive way to design a power PCB board by managing adequately the current densities. The proposed procedure is based on the three dimensional finite element method and the Biot-Savart integral law. By combining these two concepts, it is possible to determine a zero field path used to define the integration surface for the flux computation and consequently the leakage inductance. The method efficiency is demonstrated on a 24 V - 417 A buck converter printed circuit board used in low voltage high current applications. A detailed method used to estimates the leakage inductance during the hard switching process is also presented. Numerical as well as experimental results are shown and compared to prove the viability of the proposed approach.
  • Keywords
    current density; electromagnetism; finite element analysis; integral equations; printed circuits; switching convertors; Biot-Savart integral law; PCB board; buck converter; current 417 A; current densities; finite element method; hard switching process; high power density converters applications; leakage inductance calculation; magnetic field; printed circuit board; voltage 24 V; zero field path; Buck converters; Current density; Energy management; Finite element methods; Inductance; Integral equations; Low voltage; Magnetic fields; Power electronics; Printed circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics Society, 2007. IECON 2007. 33rd Annual Conference of the IEEE
  • Conference_Location
    Taipei
  • ISSN
    1553-572X
  • Print_ISBN
    1-4244-0783-4
  • Type

    conf

  • DOI
    10.1109/IECON.2007.4459993
  • Filename
    4459993